The following tips can help you better use conductive mica powder:

(1) The conductive function of conductive and anti-static materials is related to conductive fillers, basic resins, additives, solvents, and processing techniques. In coating systems, it is also related to the electrical function of the coated object. Under normal circumstances, when the amount of conductive mica powder added is 20-25% (component percentage PWC), the electrical resistivity of the product can reach 105-106 Ω· cm.

(2) Conductive mica powder can be used alone or in collaboration with other conductive powders (such as conductive titanium dioxide, conductive barium sulfate, etc.). Considering the contact area and shear force of conductive fillers during the processing, generally speaking, the use of sheet-like conductive fillers with conductive mica powder is more effective in coatings and ink systems; In some situations, the collaborative use of two different shapes or particle sizes of conductive powders can result in better conductivity, such as conductive mica powder: conductive titanium dioxide (or conductive barium sulfate)=4:1~10:1. The filling structure of conductive fillers has a direct impact on conductivity, and uneven structures have better conductivity than uniform structures, which can be explained by the size of the contact area. In terms of the amount of conductive powder added, the conductivity of the product advances with the addition of its amount. When a certain amount is reached (called the critical addition amount or critical concentration), the conductive function is enhanced, and the electrical function changes or decreases beyond a steady state in the future.

(3) Conductive mica powder is relatively loose in aqueous systems. Before stirring and loosening, moisten with a similar solvent, and then add the moist slurry to the system for a brief loosening. The loosening effect can be improved by using forward stirring speed, adding loosening agent, two roll and three roll grinding, and other methods. If a loosening agent is used, it will shorten the loosening time. During the loosening process, the shear force should not be too large, otherwise the conductive powder structure will be damaged. When using ball milling or sand milling methods for grinding, the fineness should be adjusted, the time should be shortened as much as possible, and the damage to the conductive powder structure should be minimized.

(4) When conductive mica powder is used together with conventional pigments (fillers), the conventional pigments (fillers) should first be pre loosened through conventional methods, and then participate in the conductive powder through simple loosening. To improve the anti settling properties of conductive powders, it is recommended to use thixotropic agents such as hydrogenated castor oil derivatives, organic modified bentonite, ultrafine SiO2, etc. If sedimentation cannot be avoided, flocculants (such as Terrg-P, Anti rerra-203, Texaphor-963, etc.) can be used to control sedimentation. Simply stir to loosen.

Article source: Taishan conductive mica particles

http://www.tampabloggers.com